Sensor K de alta precisión + control de circuito cerrado + controlador de temperatura independiente
Potencia del calentador:
Calentador superior 1200 W (máx.), calentador inferior 1200 W (máx.)
Fuente de alimentación:
CA 100 V / 220 V ± 10 % 50/60 Hz
Precisión de montaje:
±0,01 mm
Dimensiones generales:
Largo 450 mm × Ancho 470 mm × Alto 670 mm
Detalles de empaquetado:
De madera
Capacidad de la fuente:
50 PC/Mes
Resaltar:
Touch Screen BGA Rework Station
,
High Speed PCB Rework Station
,
CCD Optical Alignment Rework Station
Descripción del producto
High Speed Touch Screen BGA Rework Station 5 Modes Stepping Motor CCD Color Optical Alignment System 0 01mm Mounting Accuracy BGA Chip Repair Machine SMT Component Rework Equipment For Motherboard IC Chip Repair Product Introduction The Manual BGA Rework Station is an advanced, professional-grade repair equipment engineered for the precise removal, placement, and reballing of Ball Grid Array (BGA) components. Designed to meet the rigorous demands of modern electronics